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PLAYSTATION 3 (PS3)
at 4:00AM PST on April 25, 2008.
Article: Lighter, More Efficient PS3s in the Works
Furukawa Electric exhibited the “third generation” PS3 heat sink at Techno-Frontier 2008 in Japan earlier this month, reports TechOn. The heat sink is characterized by its small size, light weight and low cost. The report says that separate heat sinks will for the first time be used to cool the PS3’s Cell microprocessor and RSX graphics chips. The separate heat sinks will weigh in at about 350g in total, in comparison to 700g and 500g for the first and second designs used in PS3s.
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